Serial data input/output method and apparatus

ABSTRACT

A serial scan path communication architecture includes a plurality of circuits (30), some of which may include a memory (36). A memory access controller (38) is included on circuits with a memory (36) such that serial data may be written to and written from the memories without having to repetitively cycle through multiple shift operations.

This application is a division of application Ser. No. 08/935,751, filedSep. 23, 1997, now U.S. Pat. No. 6,085,344; which is a continuation ofapplication Ser. No. 08/415,121, filed Mar. 29, 1995, now U.S. Pat. No.5,687,179; which is a continuation of application Ser. No. 08/082,008,filed Jun. 24, 1993, now abandoned; which is a continuation ofapplication Ser. No. 07/863,517, filed Mar. 31, 1992, now abandoned;which is a continuation of application Ser. No. 07/502,470, filed Mar.30, 1990 now abandoned.

TECHNICAL FIELD OF THE INVENTION

This invention relates in general to integrated circuits, and moreparticularly to serial data communication interfaces and architectures.

BACKGROUND OF THE INVENTION

Advance circuit design techniques have resulted in increasingly complexcircuits, both at the integrated circuit and printed circuit board levelof electronic design. Diminished physical access is an unfortunateconsequence of denser designs and shrinking interconnect pitch.Testability is needed, so that the finished product is still bothcontrollable and observable during test and debug. Any manufacturingdefect is preferably detectable during final test before product isshipped. This basic necessity is difficult to achieve for complexdesigns without taking testability into account in the logic designphase, so that automatic test equipment can test the product. Exemplarytest architectures are disclosed in U.S. patent application Ser. Nos.07/391,751 and 07/391,801, to Whetsel, both filed Aug. 9, 1989, and theentire issue of the Texas Instruments Technical Journal, Vol. 5, No. 4,all of which are incorporated by reference herein.

Some existing test bus interfaces allow serial data to be shifted in andout of integrated circuits to facilitate testing of the logic in thedevice. These buses are designed primarily to transfer a single patternof serial data into a selected scan path of the integrated circuit onceper shift operation. However, in some applications, it may be requiredto utilize a serial test bus to load or unload a local memory in theintegrated circuit. Since memories contain multiple data storagelocations, multiple data patterns must be input using multiple shiftoperations. As a result, transferring data patterns into or out ofmemory is extremely time consuming due to the multiple shift operations.

Therefore, a need has arisen in the industry for a serial data input andoutput method which allows devices to be accessed in a more efficientmanner than previously achieved.

SUMMARY OF THE INVENTION

In accordance with the present invention, a data communication interfaceis provided which substantially eliminates or prevents the disadvantagesand problems associated with prior interface devices.

In the present invention, a data communication interface is provided forcommunication with a device. The data communication device includes buscircuitry for transferring data, storage circuitry coupled to the deviceand to the bus circuitry, and test interface circuitry operable to shiftdata between the bus and the device. Device access control circuitry isoperable to transfer data between the device and the storage circuitryresponsive to a control signal.

The present invention provides the technical advantage of allowingefficient communication with a device. The invention is compatible withexisting interface structures and requires only minimal additionalhardware.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings, in which:

FIG. 1 illustrates a block diagram of a prior art test bus;

FIG. 2 illustrates a Test Access Port (TAP) state diagram;

FIG. 3 illustrates a shift path through multiple integrated circuits;

FIG. 4 illustrates an integrated circuit structure with a more detailblock diagram of a target integrated circuit therein;

FIG. 5 illustrates a block diagram of the target integrated circuit ofFIG. 4, including a memory access controller;

FIG. 6 illustrates a block diagram of a memory access controller;

FIG. 7 illustrates a block diagram of a header detector circuit whichmay be used in the memory access controller of FIG. 6; and

FIG. 8 illustrate a block diagram of a counter circuit which may be usedin the memory access controller of FIG. 6.

DETAILED DESCRIPTION OF THE INVENTION

The preferred embodiment of the present invention is best understood byreferring to FIGS. 1-8 of the drawings, like numerals being used forlike and corresponding parts of the various drawings.

FIG. 1 illustrates a block diagram of prior art test bus andarchitecture 10. The architecture 10 includes TDI (test data input), TCK(test clock), and TMS (test mode select) inputs and a TDO (test dataoutput) output. The TCK and TMS inputs are connected to a TAP (testaccess port) 12. The output of the TAP 12 is connected to data registersDREG1 14 and DREG2 16, bypass register 18 and instruction register IREG20. The outputs of DREG1 14, DREG2 16 and bypass register 18 areconnected to a first multiplexer 22. The output of the first multiplexer22 and an output of the IREG 20 is connected to a second multiplexer 24.REG 20 is also connected to bypass register 18 and to the select port ofthe first multiplexer 22. The output of the TAP 12 is connected to IREG20 and to the select port of the second multiplexer 24. The TDI input isconnected to DREG1 14, DREG2 16, bypass register 18 and IREG 20. Theoutput of the second multiplexer 24 is connected to the TDO output. Theconnection between the TAP 26 and DREGs 14 and 16, bypass register 18,IREG 20 and multiplexer 24 comprises a first control bus 28. Theconnections between IREG 20, bypass register 28 and first multiplexer 22comprises a second control bus 28.

The architecture 10 shown in FIG. 1 corresponds to the IEEE P1149.1 testbus. While many types of test buses exist, the IEEE P1149.1 test buswill be used in this disclosure to describe the advantages of theinvention. This architecture has been developed to provide a standardmethod to serially access serial shift registers in IC designs tofacilitate testing. This test architecture, shown in FIG. 1, comprisesan instruction register (IREG) 20, a set of data registers 14 referredto as bypass 18, DREG1 14 and DREG2 16, and a test interface referred toas a Test Access Port (TAP) 12. While only one IREG 20 may beimplemented in the architecture, any number of DREGs can be included.Also, to conform to the P1149.1 standard, one of the DREGs must bededicated to serve as a single bit bypass DREG. This bypass DREG allowsabbreviating the data register scan path length through an IC to onlyone bit.

The IREG 20 and DREGs 14-18 exist on separate scan paths arranged inparallel between the test data input pin (TDI) and test data output pin(TDO). During IREG scan operations, the TAP 12 receives external controlvia the test mode select (TMS) and test clock (TCK) signals and outputsinternal control via the control bus 26 to shift data through the IREG20 from the TDI input to the TDO output. Similarly, DREG scan operationsare accomplished by the TAP 12 receiving external control on the TMS andTCK input and outputting internal control on control bus 26 to shiftdata through the selected DREGS. Control for selecting one of the DREGscomes from the instruction shifted into the IREG and is output from theIREG via control bus 28. The control output on bus 28 is input to allDREGs and selects one for shifting. Control bus 28 is also input tomultiplexer 22 to couple the serial output of the selected DREG to theTDO output.

The TAP 12 is a finite state machine which responds to a scan accessprotocol input via the TMS and TCK inputs. The purpose of the TAP 12 isto respond to the input scan access protocol to shift data througheither the IREG 20 or a DREG 14-18. The TAP is clocked by the TCK inputand makes state transitions based on the TMS input.

The TAP state diagram is shown in FIG. 2 and comprises sixteen states:test logic reset (TLRESET), run test/idle (RT/IDLE), select dataregister scan (SELDRS), select instruction register scan (SELIRS),capture data register (CAPTUREDR), shift data register (SHIFTDR), exit1data register (EXIT1DR), pause data register scan (PAUSEDR), exit2 dataregister (EXIT2DR), update data register (UPDATEDR), capture instructionregister (CAPTUREIR), shift instruction register (SHIFTIR), exit1instruction register (EXIT1IR), pause instruction register scan(PAUSEIR), exit2 instruction register (EXIT2IR), and update instructionregister (UPDATEIR).

At power-up or during normal operation of the host IC, the TAP will bein the TLRESET state. In this state, the TAP issues a reset signal thatplaces all test logic in a condition that will not impede normaloperation of host the IC. When test access is required, a protocol isapplied via the TMS and TCK inputs, causing the TAP to exit the TLRESETstate and enter the RT/IDLE state. In FIG. 2, the TMS input that causesmovements between the TAP states is indicated by a logic 0 or 1. TCK isthe clock that causes the TAP state controller to transition fromstate-to-state.

From the RT/IDLE state, an instruction register scan protocol can beissued to transition the TAP through the SELDRS and SELIRS states toenter the CAPTUREIR state. The CAPTUREIR state is used to preload theIREG with status data to be shifted out of the TDO output pin. From theCAPTUREIR state, the TAP transitions to either the SHIFTIR or EXIT1IRstate. Normally, the SHIFTIR will follow the CAPTUREIR state so that thepreloaded data can be shifted out of the IREG for inspection via the TDOoutput while new data is shifted out of the IREG via the TDI input.Following the SHIFTIR state, the TAP either returns to the RT/IDLE statevia the EXIT1IR and UPDATEIR states or enters the PAUSEIR state viaEXIT1IR. The reason for entering the PAUSEIR state would be totemporarily suspend the shifting of data through the IREG. From thePAUSEIR state, shifting can be resumed by re-entering the SHIFTIR statevia the EXIT2IR state or it can be terminated by entering the RT/IDLEstate via the EXIT2IR and UPDATEIR states.

From the RT/IDLE state, a data register scan protocol can be issued totransition the TAP through the SELDRS state to enter the CAPTUREDRstate. The CAPTUREDR state is used to preload the selected DREG withdata to be shifted out of the TDO output pin. From the CAPTUREDR state,the TAP transitions to either the SHIFTDR or EXIT1DR state. Normally theSHIFTDR will follow the CAPTUREDR state so that the preloaded data canbe shifted out of the DREG for inspection via the TDO output while newdata is shifted into the DREG via the TDI input. Following the SHIFTDRstate, the TAP either returns to the RT/IDLE state via the EXIT1IR andUPDATEIR states or enters the PAUSEIR state via EXIT1IR. The reason forentering the PAUSEIR state would be to temporarily suspend the shiftingof data through the IREG. From the PAUSEIR state, shifting can beresumed by re-entering the SHIFTIR state via the EXIT2IR state or it canbe terminated by entering the RT/IDLE state via the EXIT2IR and UPDATEIRstates.

From the RT/IDLE state, a data register scan protocol can be issued totransition the TAP through the SELDRS state to enter the CAPTUREDRstate. The CAPTUREDR state is used to preload the selected DREG withdata to be shifted out of the TDO output pin. From the CAPTUREDR state,the TAP transitions to either the SHIFTDR or EXIT1DR state. Normally,the SHIFTDR will follow the CAPTUREDR state so that the preloaded datacan be shifted out of the DREG for inspection via the TDO output whilenew data is shifted out of the DREG for inspection via the TDO outputwhile new data is shifted into the DREG via the TDI input. Following theSHIFTDR state, the TAP either returns to the RT/IDLE state via theEXIT1DR and UPDATEDR states or enters the PAUSEDR state via EXIT1DR. Thereason for entering the PAUSEDR state would be to temporarily suspendthe shifting of data through the DREG. From the PAUSEDR state, shiftingcan be resumed by re-entering the SHIFTDR state via the EXIT2DR state orit can be terminated by entering the RT/IDLE state via the EXIT2DR andUPDATEDR states.

In an application, any number of ICs that implement the P1149.1architecture can be serially connected together at the circuit boardlevel, as shown in FIG. 3. Similarly, any number of circuit boards canbe connected together to further increase the number of ICs seriallyconnected together. The ICs 30 in FIG. 3 are connected serially viatheir TDI input and TDO output pins from the first to the last IC. Also,each IC receives TMS and TCK control inputs from a test bus controller32. The test bus controller also outputs serial data to the TDI input ofthe first IC in the serial path and receives serial data from the TDO ofthe last IC in the serial path. The test bus controller can issuecontrol on the TMS and TCK signals to cause all the ICs to operatetogether to shift data through either their internal IREG or DREGs,according to TAP protocol previously described.

During IREG shift operations, the total length of the shift path isequal to the sum of the bits in each ICs IREG. For example, if onehundred ICs are in the serial path of FIG. 3 and each IC's IREG is eightbits long, the number of bits that must be shifted per IREG shiftoperation is eight hundred. Similarly, during DREG shift operations, thetotal length of the serial path is equal to the sum of the bits in eachIC's selected DREG. If the bypass DREG is selected in each IC, the totalnumber of bits shifted during a DREG scan is equal to the number of ICstimes one bit, since the bypass DREG is only one bit long. Each IC canselect a different DREG by loading in different instructions into theIREG. For instance, the first IC could be selecting a DREG with manybits while all other select their bypass DREG. Typically, when notesting is being performed in an IC, its bypass DREG is selected toreduce the IC's DREG bit length to a single bit.

FIG. 4 shows an arrangement of ICs connected on the P1149.1 test bussimilar to that of FIG. 3. The middle IC, referred to as the target 33,in the group contains a DREG 34 that is coupled to a device, shown asmemory 36, to allow loading and/or unloading data to or from via thetest bus. A view of the DREG and memory inside the target IC 33 is shownin FIG. 4. While the device associated with DREG 34 is shown as amemory, a data source or destination, such as an interface with anotherIC or board, could be coupled to the DREG 34. There are "n" ICs betweenthe target IC's TDI input and the test bus controller's TDO output.Also, there are "m" ICs between the target ICs TDO and the test buscontroller's TDI input.

During memory read operations, the test bus controller 32 inputs controlon the TMS and TCK inputs of the ICs in FIG. 4 to load instructions intoeach IC's IREG. To reduce the scan path length to a minimum length, allthe ICs except for the target IC are loaded with an instruction whichselects their bypass DREG. The target IC is loaded with an instructionthat selects the DREG connected to the internal memory and configuresthe DREG and memory for a read operation.

When reading data from the memory 36 of the target IC, the test buscontroller 32 only needs to input data from its TDI input; it does notnecessarily need to output data from its TDO output. The bit length ofthe serial data input to the test bus controller is determined by thenumber of bits in the memory word plus a bit for each IC's (T+1 . . .T+m) bypass register. Assuming the memory word width is eight bits andone hundred ICs exist between the target IC 33 and the test buscontroller 32, the number of bits that must be input to the test buscontroller 32 for each read operation is 108 bits.

During memory read operations, the TAP of each IC responds to theexternal TMS and TCK control signals from the test bus controller 32 tooutput internal control of bus 26 (see FIG. 1) to cause their DREGs topreload the data. The target IC's DREG preloads with the eight bitmemory data word and the bypass registers of the other ICs T+1 throughT+m) each preload with a logic zero. After the DREGs of each IC areloaded the test bus controller issues control on TMS and TCK to causethe TAPs in each IC to output internal control on bus 26 to shift outthe data loaded in each IC's DREG.

The serial data input to the test bus controller's TDI input is a streamof 108 bits. The first one hundred bits are all logic zeros from thebypass registers of ICs T+1 through T+m, and the last eight bits are thedata read from the memory of the target IC. After the test buscontroller has received all 108 bits, it terminates the shiftingoperation by issuing control on the TMS and TCK signals to cause eachTAP in each IC to halt the shifting process. This described process ofpreloading data, shifting out from the target IC, followed by haltingthe shift operation must be repeated for each additional data patternread from the memory.

Table 1 shows the states (previously discussed in connection with FIG.2) that the TAP of each IC in FIG. 4 must transition through to read onememory word. In Table 1, it is seen that it takes three TCKs at thestart of each read operation before the shifting of data begins. One ofthe three TCKs is used to load data into the DREGs, the bypass registersof ICs T+1 through m are loaded with a logic zero and the DREG of thetarget IC is loaded with the eight bit memory word. The shifting of thedata out of the ICs and into the test bus controller requires 108additional TCKs. After the 108 bit data pattern is shifted out it takestwo additional TCKS to terminate the memory read operation. The totalnumber of TCKs required to read one 8-bit memory word from the target ICin FIG. 4 is 113. Thus, if the memory has 1,000 words to be read, thestate sequences in Table 1 must be repeated 1,000 times for a total of113,000 TCK cycles.

                                      TABLE 1                                     __________________________________________________________________________     ##STR1##                                                                     __________________________________________________________________________

During memory write operations, the test bus controller inputs controlon the TMS and TCK inputs of the ICs in FIG. 4 to load instructions intoeach IC's IREG. To reduce the scan path length to a minimum length, allthe ICs except for the target IC are loaded with an instruction whichselects their Bypass DREG. The target IC is loaded with an instructionthat selects the DREG connected to the internal memory and configuresthe DREG and memory for a write operation.

When writing data into the memory of the target IC, the test buscontroller only needs to output data from its TDO output, it does notnecessarily need to input data from its TDI input. The bit length of theserial data output from the test bus controller is determined by thenumber of bits in the memory word plus a bit for each IC's (1 . . . n)bypass register. Assuming the memory word width is eight bits and onehundred ICs exist between the test bus controller and the target IC, thenumber of bits that must be output to the target IC for each writeoperation is 108 bits.

During memory write operations, the TAP of each IC responds to theexternal TMS and TCK control signals from the test bus controller tooutput internal control on bus 26 (see FIG. 1) to cause their DREGs topreload the data. The target IC's DREG preloads "don't care" data sinceit is not reading memory data and the bypass registers of the other ICs(1 through n) each preload with a logic zero. After the DREGs of each ICare loaded, the test bus controller issues control on TMS and TCK tocause the TAPs in each IC to output internal control on bus 26 to shiftin the 8-bit data word output from the test bus controller.

The destination of the 8-bit data word is the 8-bit DREG of the targetIC. However, before the 8-bit data word enters to the target IC, it mustfirst be shifted through the bypass bits of ICs 1 through n. To inputthe 8-bit data word into the DREG of the target IC, the test buscontroller outputs control on TMS and TCK signals to cause 108 bits ofdata to be shifted. After 108 data bit shifts, the 8-bit data word hasbeen shifted through the one hundred bypass register bits of ICs 1through m and into the 8-bit DREG of the target IC. After the data wordis loaded into the DREG of the target IC, the test bus controlleroutputs control on the TMS and TCK signals to halt the shifting processand load the data word into the memory. This described process ofpreloading data, shifting data into the target IC, followed by writingthe data into the memory, must be repeated for each additional data wordwritten into the memory.

Table 2 shows the states (as discussed in connection with FIG. 2) thatthe TAP 12 of each IC 30 in FIG. 4 must transition through to write onememory word. In Table 2, it is seen that it takes three TCKs at thestart of each write operation before the shifting of data begins. one ofthe three TCKs is used to load data into the DREGS, the bypass registersof ICs 1 through n is loaded with a logic zero and the DREG of thetarget IC is loaded with a "don't care" data pattern. The shifting ofthe data through the one hundred leading ICs and into the DREG of thetarget IC requires 108 additional TCKs. After the 8-bit data pattern isshifted into the DREG of the target IC, it takes two additional TCKs tohalt the shift operation and write the data into the memory. The totalnumber of TCKs required to write one 8-bit memory word into the targetIC's memory is 113. If the memory has 1,000 words to be written, thestate sequences in Table 2 must be repeated 1,000 times for a total of113,000 TCK cycles.

                                      TABLE 2                                     __________________________________________________________________________    Writing Data Into Memory Using P1149.1 TAP Protocol                           __________________________________________________________________________     ##STR2##                                                                     __________________________________________________________________________

From these two examples, it is clear that an exceptionally large numberof TCKs is required to load or unload data into a memory using theP1149.1 TAP protocols. Since the memory access time increases linearlywith the number of TCKs required, it can take an exceptionally long timeto load or unload a memory using the P1149.1 TAP protocols. Using theexamples described above and a TCK frequency of 1 MHz, the access timefor a memory with 1,000 locations is equal to:

    (113,000 TCKs)×(1 microseconds/TCK)=113 milliseconds

The preferred embodiment of the present invention decreases theread/write access time to memories by providing a controller designed tobe compatible with the P1149.1 architecture, or any other type of serialbased scan architecture. This controller is referred to as a memoryaccess controller (MAC) and provides the internal timing and controlrequired to allow a memory to be continuously written to or read fromusing a single P1149.1 TAP write or read operation. The advantages ofthis approach is it eliminates the need of having to repetitively cyclethrough multiple TAP read or write operations as previously described.

In FIG. 5, the MAC of the preferred embodiment is shown included in withthe P1149.1 architecture, along with a DREG and memory combination asdescribed earlier. FIG. 5 differs from FIG. 1 in that the MAC 38receives input from test bus 28 and the TDI input, and outputs a TDOoutput to multiplexer 22. When no memory access operations are beingperformed, the MAC 38 is inactive and the architecture operates asdescribed in connection with FIG. 1. However, when an instruction isloaded into the IREG enabling a memory read or write operation, the MACis enabled, via control input from bus 28, to operate synchronously withthe TAP 12 and the TMS and TCK control inputs.

During memory access operations, the MAC 38 takes over control of thesignals output from the TAP 12 on bus 26 that operate the DREG andmemory shown in FIG. 5. The MAC 38 monitors the TAP and TMS and TCKinputs during memory access and outputs control on bus 26 to perform thefunctions required during read and write operations. During memory readoperations, the MAC determines when memory data is to be loaded into theDREG 34 to be shifted out to the test bus controller. During memorywrite operations, the MAC determines when the data shifted into the DREG34 from the test bus controller 32 is to be loaded into the memory. Thefollowing examples illustrate the improvement the MAC provides formemory read and write operations over the previous method.

The internal architecture of the target IC in FIG. 4 includes the MAC asshown in FIG. 5. During memory read operations, the test bus controllerinputs control on the TMS and TCK inputs of the ICs in FIG. 4 to loadinstructions into each IC's IREG. All the ICs except for the target IC33 are loaded with an instruction which selects their bypass DREG. Thetarget IC is loaded with an instruction that enables the MAC 38 andconfigures the DREG and memory for a read operation. The DREG 34 of thetarget IC is eight bits in length and one hundred ICs (T+1 through T+m)exist between the target IC and the test bus controller.

Since the MAC 38 controls when the DREG 34 loads and shifts out memorydata, the task of reading the entire memory can be performed in one readoperation. When the test bus controller 32 starts the read operation byissuing control on the TMS and TCK signals, the bypass registers of ICT+1 through T+m preload logic zeros and the MAC 38 loads the DREG of thetarget IC with the first 8-bit memory data word. When the test buscontroller 32 outputs control to start the shift operation the bypassregisters of ICs T+1 through T+m and the DREG of the target IC startshifting data towards the TDI input of the test bus controller.

At the end of eight data bit shifts the 8-bit data word initially loadedinto the target IC's DREG is shifted out of the DREG and into the bypassbits of the first eight ICs (T+1 through T+8). When the last data bit(8th bit) is shifted out of the DREG, the MAC 38 outputs control on bus26 to load the next 8-bit data word from the memory 36. This loadoperation occurs during the TCK that shifts out the last (8th) bit ofthe DREG 34 so that the first bit of the next word can be shifted out onthe next TCK shift cycle. The bypass bits of ICs 1 through m act astemporary storage locations for the memory data enroute to the test buscontroller's TDI input. The MAC 38 repeats this load/shift operationevery eight TCKs until the last 8-bit data word has been loaded andshifted out of the target IC's memory. The test bus controller continuesthe read operation until it receives all the memory data bitstemporarily stored in the bypass bits of ICs T+1 through T+m.

During the memory read operation, the first one hundred bits input tothe TDI input of the test bus controller is a stream of logic zeros fromthe initial preloading of the bypass register bits in ICs T+1 throughT+m. After the one hundred logic zeros have been shifted out of thebypass bits, the test bus controller 32 starts to receive the 8-bitserial data words from the memory of the target IC. Assuming the memorycontained 1,000 8-bit data words, the test bus controller receives 1,000packets of 8-bit serial data words after the initial one hundred bypassbits have been received. After the test bus controller 32 receives theserialized memory data it issues control on the TMS and TCK signals tocause the TAPs 12 in the ICs 30 of FIG. 4 to halt the shifting processand terminate the read operation.

Table 3 shows the states (FIG. 2) that the TAP of each IC in FIG. 4 musttransition through during the read operation using the MAC. In Table 3,it is seen that it takes three TCKs at the start of the read operationbefore the shifting of data begins. One of the three TCKs is used toload data into the DREGS, the bypass registers of ICs T+1 through T+m isloaded with a logic zero and the DREG of the target IC is loaded withthe first 8-bit memory word. Before the test bus controller 32 beginsreceiving data, all one hundred of the logic zeros loaded into thebypass registers bits must be shifted out of ICs T+1 through T+m, whichtakes one hundred TCKs. After the one hundred logic zeros are output,the test bus controller 32 starts receiving the 1,000 8-bit serial datawords from the memory of the target IC, which requires 8,000 TCKs. Afterthe test bus controller 32 has received the 8,000 data bits from thememory, it takes two additional TCKs to terminate the memory readoperation. The total number of TCKs required to read the 1,000 8-bitmemory words from the target IC of FIG. 4 is:

    3+100+8,000+2=8,105 TCKs.

                                      TABLE 3                                     __________________________________________________________________________    READING DATA FROM MEMORY USING MAC                                            __________________________________________________________________________     ##STR3##                                                                     __________________________________________________________________________

During memory write operations, the test bus controller 32 inputscontrol on the TMS and TCK inputs of the ICs 30 in FIG. 4 to loadinstructions into each ICs IREG. All the ICs except for the target ICare loaded with an instruction which selects their bypass DREG. Thetarget IC is loaded with an instruction that enables the MAC 38 andconfigures the DREG 34 and memory 36 for a write operation. The DREG 34of the target IC 34 is eight bits in length and one hundred ICs (T+1through T+m) exist between the test bus controller 32 and the target IC33.

Since the MAC 38 controls when the DREG 34 shifts in data and writes itinto memory 36, the task of writing the entire memory can be performedin one write operation. When the test bus controller 32 starts the writeoperation by issuing control on the TMS and TCK signals, the bypassregisters of IC 1 through n preload logic zeros and the MAC 38 preparesthe memory to accept the first data word. When the test bus controlleroutputs control to start the shift operation, the bypass registers ofICs 1 through n start outputting logic zeros and inputting data from thetest bus controller 32. The MAC 38 in the target IC delays writing datainto the memory until it receives a START signal. The START signalindicates that all the logic zeros have been shifted out of the bypassbits in ICs 1 through n and that the bypass bits have been filled withdata from the test bus controller 32 that is to be loaded into thetarget ICs memory.

When the MAC 38 receives the START signal, it begins shifting data intothe DREG. The bypass bits in ICs 1 through n act as temporary storagelocations for the data enroute to the target IC 33. After the DREG hasaccepted eight bits of data, the MAC 38 outputs control to write the8-bit data word into the memory. This process of accepting eight bits ofdata into the DREG followed by writing the 8-bit data word into thememory continues while the write operation is in progress. After thetest bus controller 32 has output all the data to be written into thetargets memory and has shifted the data through the bypass bits of ICs 1through n and into the target IC memory, it terminates the writeoperation by outputting control on the TMS and TCK signals.

Table 4 shows the states (as discussed in connection with FIG. 2) thatthe TAP 12 of each IC 30 in FIG. 4 must transition through during thewrite operation. This table assumes one hundred ICs between the test buscontroller 32 and the target 33 and a memory 36 with 1,000 data words.In Table 4, it is seen that it takes three TCKs at the start of thewrite operation before the shifting of data begins. One of the threeTCKs is used to load the bypass registers of the one hundred ICs withlogic zeros. Before the MAC 38 enables the DREG 34 to accept serialdata, all one hundred of the logic zeros must be shifted out of thebypass register bits of the one hundred ICs, requiring one hundred TCKs.After the one hundred logic zeros are shifted out, the MAC startsaccepting the 1,000 8-bit data words transmitted to the target IC fromthe test bus controller 32 via the bypass bits in ICs 1 through n. Thisoperation requires 8,000 TCKs. After the test bus controller has inputthe 8,000 data bits into the target IC's memory, it takes two additionalTCKs to terminate the memory write operation. The total number of TCKsrequired to write the 1,000 8-bit memory words into the target IC'smemory is:

    3+100+8,000+2=8,105 TCKs.

                                      TABLE 4                                     __________________________________________________________________________    WRITING DATA TO MEMORY USING MAC                                              __________________________________________________________________________     ##STR4##                                                                     __________________________________________________________________________

From these two examples, it is clear that the MAC significantly reducesthe number of TCKs required to access memory when compared to theprevious two examples using the P1149.1 TAP protocols to access memory.Using the two MAC examples described above and a TCK frequency of 1 MHz,the access time for a memory with 1,000 location is equal to:

    (8,105 TCKs)×(1 microseconds/TCK)=8.105 milliseconds

Comparing the 8.1 millisecond access time using the MAC with the 113milliseconds access time using the P1149.1 TAP protocol shows that theMAC can access an identically sized memory using only 7% of the timerequired by the P1149.1 TAP protocol.

In the description of the MAC writing data into the memory, referencewas made to a START signal. The START signal informs the MAC 38 that itis time to start inputting data from the bypass bits and storing it intothe memory 36. The following four methods can be used to produce a STARTsignal to the MAC. Other methods besides the ones mentioned below may bedevised to start the write operation.

After a write operation is started, the TAPs 12 of the ICs 30 will be inthe SHIFTDR state. Since the test bus controller knows how many ICs (1through n) lie between its output and the target IC's input, it cancreate a START signal after the data has been shifted into bypass bitsof the leading ICs (1 through n) by transitioning the TAP from theSHIFTDR state into the PAUSEDR state via the EXIT1DR state, thenre-entering the SHIFTDR state from the PAUSEDR state via the EXIT2DRstate. The MAC in the target IC can be designed to start the writeoperation based on sensing the TAP enter the PAUSEDR state a first time.Once the write operation is started the MAC ignores any subsequentPAUSEDR state entries during the rest of the write operation.

Since the test bus controller knows how many ICs (1 through n) liebetween its output and the target IC's input, it can create a STARTsignal by outputting a series of bits, referred to as a header, whichprecede the actual serial data bits that are to be written into thememory. The MAC 38 in the target IC 33 can be designed to monitor forthe occurrence of a header by inspecting the serial data bits outputfrom the bypass bits of ICs 1 through n. Since the bypass bits willinitially be outputting logic zeros from the preload operation, the MACmonitors for a first logic one, which is output prior to the data and isthe start bit of the header. Following the first logic one, anadditional number of header bits may be input to the MAC, if desired, toreduce the probability of starting a write operation on a false headerinput. The MAC knows the header bit length and pattern sequence. AfterMAC receives all the header bits, it starts the write operation.

The MAC 38 may be designed to include a counter which can be loadedprior to a write operation. The counter is loaded with the number of ICs(1 through n) that lie between the target IC and the test buscontroller. After the write operation is started, the MAC 38 startsdecrementing the counter during each shift operation. When the counterreaches a minimum count, data to be shifted into the memory is presenton the target IC's TDI input and the MAC 38 starts inputting the dataand storing it into memory.

The MAC 38 may be designed to allow monitoring a pin on the IC todetermine when the write operation is to be started. In this method, thetest bus controller would output a signal via an additional test pin toindicate to the target IC 33 that data is available at the target's TDIpin to input and store into the internal memory. This signal would beoutput from the test bus controller to the target IC after the data hasbeen shifted through the bypass bits of ICs 1 through n.

FIG. 6 illustrates an exemplary implementation of a MAC/TAP. In thisembodiment, the MAC 38 is operable to accept the four different types ofstart indicators previously described, namely: (1) using the TAP'sPAUSEDR signal, (2) using a Header Detector, (3) using a counter COUNTCOMPLETE signal, and (4) using an EXTERNAL TRIGGER. The TAP 12 isconnected to a multiplexer 40 via a PAUSEDR signal. The output of theTAP 12 is also connected to the input of a multiplexer 42. A HeaderDetector 44 receives the TDI signal and outputs a MATCH signal to themultiplexer 40. A Counter 46 receives the TMS and TCK signals andoutputs a COUNT COMPLETE signal to the multiplexer 40. An externaldevice node 48 is connected to the multiplexer 40. The output of themultiplexer 40, the START signal, is connected to a serial input/outputcontroller 50 along with the TMS and TCK signals. The IREG control bus28 is connected to the select ports of the multiplexers 40 and 42 and tothe serial input/output controller 50.

In operation, control from IREG bus 28 selects either the output of theTAP 12 or the output of serial input/output controller 50 to drivecontrol bus 26 via multiplexer 42. When selected, the serialinput/output controller 50 is enabled if one of the starting signals,PAUSEDR, MATCH, COUNT COMPLETE or EXTERNAL TRIGGER, are active,resulting in an active START signal.

It is important to remember that a start indicator is only requiredduring a MAC write operation; a MAC read operation does not necessarilyneed a start indicator. However, a read operation could also use a startindicator, if desired. Not all of the start indicators shown in FIG. 6need to be included in the design of the MAC. A MAC could operate withonly one of the start indicators being input to the serial input/outputcontroller, eliminating the need for the multiplexer 40. Also, othertypes of start indicators may be devised and input to the serialinput/output controller, other than the ones described in thisdisclosure.

The TAP 12 is usually selected to output control from the multiplexer 42on bus 26 to shift data through a selected DREG in the IC. The only timethe MAC 38 is selected to output control on bus 26 is when aninstruction has been loaded into the IREG 20 to select the MAC 38 for aserial input or output operation. During a MAC operated memory readoperation, the serial input/out controller 50 will be enabled by inputfrom the IREG 20 and control inputs TMS and TCK to output data from adevice. During memory read operations, no start indication is requiredand the serial input/output controller 50 responds directly to the TMSand TCK inputs to output data.

During a MAC operated memory write operation, the serial input/outputcontroller 50 will be enabled by input from the IREG and control inputsTMS and TCK to input data to a device. While control inputs from theIREG and TMS and TCK inputs arm the serial input/output controller 50for a write operation, no write action occurs until the serialinput/output controller 50 has received the START signal frommultiplexer 40.

In FIG. 6, it is seen that a write operation can be started by one offour different signals: a PAUSEDR state output from the TAP 12, a matchoutput from the Header Detector 44, a COUNT COMPLETE signal from thecounter 46, and an external node signal. The instruction in the IREG 20selects which start indicator is input to the serial input/outputcontroller 50 to start a write operation.

One method of starting a write operation utilizes the TAP's internalPAUSEDR state. If this method is selected, the PAUSEDR state (see FIG.2) is output from the TAP 12 and coupled to the serial input/outputcontroller 50 via multiplexer 40. When this method is used, the test buscontroller 32 (see FIG. 4) issues control on TMS and TCK to initiate adata register scan operation. The control causes data from the test buscontroller 32 to shift through devices 1 through n towards the targetdevice 33 (see FIG. 4). When the data arrives at the TDI input of thetarget device 33, the test bus controller 32 issues control that causesthe TAPs of all the devices (1+n and the target) to enter the PAUSEDRstate (see FIG. 2).

The serial input/output controller 50 senses the first PAUSEDR stateoutput from the TAP 12 as the start indicator and prepares to outputcontrol on bus 26 whenever the test bus controller 32 issues control onTMS and TCK to resume data shifting by re-entering the SHIFTDR state(see FIG. 2). After the shifting of data is resumed, the test buscontroller 32 will shift in all the data to be loaded into the targetdevice 33. If the test bus controller 32 re-enters the PAUSEDR stateagain during the data register scan operation, the serial input/outputcontroller 50 will ignore any additional PAUSEDR inputs from the TAP 12.When the test bus controller 32 has output the last data bit to beloaded into the target device 33, it will continue to shift the scanpath to insure that the data is passed through devices 1 through n andinto the target device before it issues control on TMS and TCK toterminate the shift operation.

One advantage of this method is that the logic to start the writeoperation already exists in the TAP and additional logic is notrequired. The other methods described below require either additionallogic or an additional device input.

Another method of starting a write operation utilizes header detectorlogic 44. A block diagram of the header detector logic 44 is shown inFIG. 7. The header detector logic 44 comprises a DREG 52 for storing aheader value, a shift register 54 for receiving a header bit sequenceduring a write operation, and a comparator logic 56 for matching theheader bit sequence received with the header pattern stored in the DREG52. During shift operations, DREG 52 is coupled to the TDI and TDO pinsof target device 33.

This technique assumes the test bus controller 32 outputs a leadingheader bit sequence (such as "101101") prior to outputting the data thatis to be written into the target device 33. During the write operation,the header detector logic 44 inputs the serial data into the shiftregister 54 and compares it against the preloaded header value in theheader storage register. Initially, the shift register 54 will reset toall zeros so that a match between the shift register and header storageregister is disabled. As the write operation starts, the shift register54 begins receiving the logic zeros from the bypass registers in devices1 through n. After the bypass register logic zeros have been received,the shift register 54 will begin receiving the header bit sequenceoutput from the test bus controller 32. When the entire header is loadedinto the shift register 54, a match will occur between the shiftregister contents and the header storage register 52. This MATCH signalis output from the compare logic and input to the serial input/outputcontroller via multiplexer 40.

When the serial input/output controller 50 senses the MATCH signal fromthe header detector 44, it outputs control on bus 26 to start acceptingthe serial data being input to the target device 33 via the TDI input.When the test bus controller 32 has output the last data bit to beloaded into the target device 33, it will continue to shift the scanpath to insure that the data is passed through devices 1 through n andinto the target device 33 before it issues control on TMS and TCK toterminate the shift operation.

Another method of starting a write operation utilizes counter logic. Ablock diagram of the counter logic 46 is shown in FIG. 8. The counterlogic 46 comprises a DREG implementing a down counter 58 and clock logic60 for producing a counter decrement clock for each bit shifted on thescan path. The down counter 58 can be shifted by a data register scanoperation to load a desired count value into the counter 58. Duringshift operations, the down counter is connected to the TDI and TDO pinsof target device 33. The counter contains decode logic to sense aminimum count value which is output from the counter via the COUNTCOMPLETE signal.

This technique requires that the test bus controller 32 loads thecounter 58 with a count value prior to performing a write operation. Thecount value loaded is equal to the number of bypass register bits (1through n) the data must pass through before being input to the targetdevice. When the test bus controller 32 starts a write operation, thecounter decrements once for each time a data bit is shifted through thescan path between the controller and target device. When the counterreaches a minimum value and outputs the COUNT COMPLETE signal, the datafrom the controller has been shifted through all the bypass registers ofthe devices 1 through n and is applied to the TDI input pin of thetarget device.

When the serial input/output controller 50 senses the COUNT COMPLETEsignal from the counter 58, it outputs control on bus 26 to startaccepting the serial data being input to the target device 33 via theTDI input. When the test bus controller 32 has output the last data bitto be loaded into the target device 37, it will continue to shift thescan path to insure that the data is passed through devices 1 through nand into the target device 33 before it issues control on TMS and TCK toterminate the shift operation.

Another method of starting a write operation utilizes an additionaldevice input node 48, as shown in FIG. 6. The input source to this pinmay come from the test bus controller 32 or from another device whichcan output a signal to indicate when the MAC should start accepting dataat the target device's TDI input pin during a write operation.

When the serial input/output controller 50 senses the external triggerinput signal from the device node 48, it outputs control on bus 26 tostart accepting the serial data being input to the target device 33 viathe TDI input. When the test bus controller has output the last data bitto be loaded into the target device 32, it will continue to shift thescan path to insure that the data is passed through devices 1 through nand into the target device before it issues control on TMS and TCK toterminate the shift operation.

While the preferred embodiment has been illustrated using a test busconnecting a plurality of integrated circuits, the bus could similarlybe used to connect subcircuits within a single integrated circuit, or toconnect circuits each comprising a plurality of integrated circuits.Also, while the preferred embodiment has been illustrated in connectionwith the transfer of test data, it could be used for any type of datacommunication between devices.

Although the present invention has been described in detail, it shouldbe understood that various changes, substitutions and alterations can bemade herein without departing from the spirit and scope of the inventionas defined by the appended claims.

What is claimed is:
 1. A data communication interface comprising:A. afirst circuit having an output for transmitting shifted data; B. asecond circuit having an input for receiving the shifted data, acounting circuit changing its count on each shift of the shifted dataand a control circuit controlling inputting shifted data from the input;C. a data path between said output and said input through which the datamay be shifted; and D. wherein said counting circuit is loaded with apredetermined value and said second circuit delays inputting data fromsaid data path until after a number of data shifts equaling thepredetermined value have been received at said second circuit.
 2. Thedata communication interface of claim 1 wherein said counting circuit isloaded with shifted data from the first circuit.
 3. The datacommunication interface of claim 1 and further including a memoryassociated with said second circuit.
 4. The data communication interfaceof claim 3 wherein data from said data path is stored in said memoryafter said number of data shifts equaling the predetermined value havebeen received at said second circuit.
 5. The interface of claim 1 inwhich the second circuit includes:A. a test data input lead; B. a testdata output lead; C. a test mode select lead; D. a test clock lead; E.clock logic connected to the test mode select lead and the test clocklead, and having a clock lead output; and F. the counting circuit isconnected to the test data input lead, the test data output lead, and tothe clock lead and has an output count complete lead.
 6. The interfaceof claim 1 in which the first circuit is a test bus controller having atest data output lead, a test data input lead, a test mode control leadand a test clock lead and the second circuit is one of plural secondcircuits connected in series between the test data output lead and thetest data input lead and each second circuit is connected in parallelwith the test mode select lead and the test clock lead.
 7. A method ofcommunicating data between a first circuit and a second circuitcomprising the steps of:A. loading a count value in said second circuit;B. communicating data units from said first circuit to said secondcircuit; and C. monitoring data at said second circuit until a number ofdata units corresponding to the count value have been received by thesecond circuit, then inputting data units at said second circuit.
 8. Themethod of claim 7 wherein said monitoring step includes the step ofdecrementing the count value in said second circuit for each data unitreceived by the second circuit.
 9. The method of claim 8 wherein saidstep of processing data units includes the step of storing data units toa memory associated with said second circuit.
 10. The of claim 7including testing a target circuit with the data input by the secondcircuit.
 11. A process of testing a manufactured integrated circuitcomprising:A. loading a count value from a test controller to each ofplural memory access controllers, each corresponding to a targetcircuit, in the integrated circuit; B. communicating data units from thetest controller to all of the memory access controllers; and C.monitoring data at each of the memory access controllers until a numberof data units corresponding to the count value have been received by amemory access controller, then inputting data units at the targetcircuit corresponding to that memory access controller.
 12. The processof claim 11 in which the loading and communicating occurs bit by bit inseries.
 13. The process of claim 11 in which the loading andcommunicating occurs by passing bits in series through a seriesconnection of the memory access controllers.